5th PCNS PRELIMINARY PROGRAM
Note: this is a preliminary 5th PCNS program, subject to change without notice
Program At a Glance
Learn More About The Program, Papers Abstracts And Authors:
9:00-12:00 Exhibitor Set-Up Time
13:00 - 15:50 Workshop
Workshop I. Passive Components Designs
To Be Confirmed
TBC
Workshop II. ALTER TECHNOLOGY Workshop
Key Aspects of Selection, Procurement, and Testing of Passive EEE Components for Harsh Environment Applications
TBC
ALTER Workshop
16:10 - 17:30 CNA Tour
Tour through Centro Nacional de Aceleradores (CNA)
Come and join us to meet CNA accelerator facility.
CNA is located in close, walking distance from the University of Seville event location. Attendees will meet at 16:10 after coffee break at the exhibitor area (same location as coffee break) and will come together by walk to CNA
The National Accelerator Centre, CNA, is a mixed centre of the University of Seville, Junta de Andalucía and CSIC. It is a Singular Scientific-Technical Facility, ICTS, dedicated to interdisciplinary research and therefore open to external users.
For this, 6 different facilities are used: a 3 MV Van de Graaff Tandem accelerator, a Cyclotron that provides 18 MeV protons and 9 MeV deuterons, a 1 MV Cockcroft-Walton Tandem accelerator, used as a mass spectrometer, a PET/CT scanner for people, a new radiocarbon dating system called MiCaDaS, and a 60Co Irradiator.
The application of these 6 infrastructures covers fields as varied as materials science, environmental impact, nuclear and particle physics, nuclear instrumentation, medical imaging, biomedical research and preclinical molecular imaging or dating, medical imaging diagnosis in patients, Carbon 14 dating and irradiation in samples of technological and biological interest, among others.
The recently signed agreement between the Ministry of Economic Transformation, Industry, Knowledge and Universities of the Junta de Andalucía, the Superior Council of Scientific Research and the University of Seville to update the regulation of the National Accelerator Centre (CNA) adapting it to the requirements of the national and regional legal system can be found in the following link: (CNA agreement with the Junta de Andalucía, the CSIC and the US).
Since 2007, the CNA has been framed in the map of Singular Scientific Technical Facilities (ICTS). In particular, since 2022 it is part of a distributed ICTS called IABA (Accelerator-Based Application Infrastructures), from which additional information can be obtained by entering the Requests section
9:00 - 11:50 Welcome & Keynote
Chairman: Tomas Zednicek, EPCI
Welcome Speech
Welcome from EPCI European Passive Components Institute, University of Seville and ALTER TECHNOLOGY.
Tomas Zednicek Ph.D.; EPCI
EPCI President and Owner
Keynote I. Passive Components Market & Trends in Europe; presented by Luca Primavesi, president of Itelcond and EPCIA member
Market Trend Passive Components in 2024/25
Passive components are the “unseen” electrical components but essential for all electronic circuits. This talk show you the European market development trend in dependence of the type of the component and the application of the recent years.
Mission
To represent and promote the common interests of the Passive Components Manufacturers active in Europe to ensure an open and transparent market for Passive Components in Europe as part of the global market place.
Passive Components are an independent and thriving industry
Passive component manufacturers play a key role in the development of the electronics industry and more globally in the development of the e-society in Europe and the rest of the world. Every new function, every new semiconductor, generates new requirements in volume and performance for passive components. Supported by several large companies, a great number of SMEs (small and medium-sized enterprises), national associations and technological research institutes, the passive component industry has accumulated a considerable competence and know-how over the years. Electronic systems and equipment, as well as electronic components, are undergoing crucial changes. Increasing performance and miniaturisation are becoming standard requirements. European industry has been able to face up to these challenges successfully.
9:55 - 10:00 EPCIA Student Awards Ceremony
Speakers Introduction
In this section speakers from all three days will be briefly introduced.
Attendees are encouraged to network speakers and other attendees during breaks and social events.
TPI Technical Product Introduction
5 min flash presentations to introduce new product / hot items / services.
TPI is very suitable to combine with Sponsors & Exhibition Booth to introduce key products / company and invite attendees to meet at the booth
Keynote II. Quality Challenges and Risk Mitigation for Passive Components in Harsh Environments.
presented by Antonio Rodriguez Arenas, ALTER TECHNOLOGY
Antonio Rodriguez Arenas, Alter technology TüV Nord, Spain
In the procurement and qualification of passive components for use in harsh environments, quality assurance remains a central challenge, especially when dealing with COTS (Commercial-Off-The-Shelf) parts.
This presentation compiles multiple real-world case studies encountered during various projects, highlighting recurring issues such as pure tin finishes, solder joint cracks, poor adhesion in gold plating, and compatibility mismatches with assembly methods. We discuss the methods used for detection, including DPA, SEM, and outgassing/solderability assessments, and evaluate the procedural and regulatory responses, including the interpretation of standards.
A particular focus is given to proposed improvements in inspection protocols and communication practices with both suppliers and clients to ensure robust qualification pathways and risk management, especially under time-constrained or mission-critical conditions
12:30 - 13:20 Alter Finger Pick Lunch
13:20 - 14:35 Session I. HARSH APPLICATIONS
Chairman: TBC
1.1. Thermoset Polymer Dielectric Capacitors for Harsh Environment Applications
Speaker: Angelo Yializis; Polycharge Inc.; USA
Capacitors operating in harsh environments include operation in extreme conditions of temperature, mechanical stress, and radiation, often with the need for high energy density and improved reliability. Applications that combine multiple extreme operating conditions are difficult to service with a single capacitor technology. The need for high energy density is usually a requirement for applications that involve capacitors with large capacitance, frequently in combination with higher voltages. This limits the use ceramic multilayer capacitors. If temperature conditions include both cryogenic and high temperature, this limits the use of electrolytic capacitors. High temperature excludes the industry standard polypropylene film capacitors, and capacitors with high temperature films such as PPS and PTFE have poor breakdown strength. This translates to low energy density, often with prohibitive cost.
NanoLamTM capacitors developed by PolyCharge utilize a nanothick polymer dielectric that is characteristic of electrolytic capacitors, with a solid state multilayer structure characteristic of ceramic capacitors, and a thermoset polymer dielectric that can function at temperatures in excess of 200oC. Unlike high temperature thermoplastic polymer films that have low glass transition temperatures and relative low breakdown strength, the nanothick polymer dielectrics have high glass transition temperature and breakdown strength superior to all commercially available polymer films.
This in addition to self-healing properties and high degradation resistance in the presence of radiation, can qualify NanoLamTM capacitors for a wide range of harsh environment applications. Targeting defense, automotive, aerospace and spacecraft applications, parametric data of NanoLamTM capacitors operating in extreme temperature conditions is presented, along with energy density comparison with conventional polymer film capacitors.
1.2. Tantalum Capacitors Technologies for Harsh Environments
Speaker: Michel Bouvier; Vishay Tantalum Division, France
Since the early 1990s, Vishay – Sprague has pioneered the use of advanced Tantalum anode technology, incorporating techniques such as liquid delubrication, magnesium deoxidation, and anode wire welding. These innovative technology enables the production of defect-free dielectric films, which are crucial for achieving low DC leakage, long-term reliability, and enhanced resistance to reflow stress.
Additional technological features ensure stable solder reflow performance, including shell formation and beveled pellets.
Vishay’s advanced MAP capacitors packaging technology offers approximately a 40% increase in capacity per volume while maintaining stable MSL performance. The MAP polymer capacitors manufacturing process includes in-line testing and HiRel screening It demonstrated robust reflow performance and low, stable DC leakage during life tests. , along with FR assessment for polymer tantalum capacitors, compliant with Military MIL-PRF-32700/1 standards, is the next step.
Construction and environmental control measures, such as hermetically sealed polymer capacitors, wet capacitors, and HE capacitors, further enhance the reliability stability and performance of Vishay’s products, allowing the use of specific tantalum series in harsh environments.
1.3. Murata’s Silicon Capacitors: Reliable Performance in Extreme Conditions
Speaker: Enzo Darcy; Murata Europe; France
This paper examines Murata’s silicon capacitors and their performance in various demanding applications.
We evaluate their behaviour under harsh conditions, including extreme temperatures from -250 °C to +300 °C, thermal stress, vibration, shock, radiation and exposure to heavy ions.
The study focuses on advancements in miniaturization, capacitance stability, reliability, and high-frequency response.
We analyse how these silicon capacitors compare with conventional Multi Layer Ceramic Capacitors across a range of critical parameters.
Murata silicon capacitors demonstrate substantial advantages across these critical parameters providing insights into their potential applications in aerospace, cryogenics, soil drilling, and other challenging environments.
Keynote III. Advances in the Environmental Performance of Polymer Capacitors.
presented by Philip Lessner; Philip Lessner Consulting; USA
Philip Lessner, Ph.D., is a leading expert in materials and passive component development, R&D and intellectual property management.
He began his career in the passive components industry at KEMET Electronics in tantalum capacitor development eventually becoming Chief Technology Officer and Chief Scientist from 2006 to 2023 where he oversaw technical direction for all product lines and played a key role in major acquisitions and strategic planning.
He then became Executive Vice President and CTO of the YAGEO Group from 2023 to 2024 contributing to the company’s leadership in electronic components, integration of business acquisitions, and emerging applications like AI.
He holds a Ph.D. in Chemical Engineering from UC Berkeley and has an extensive patent portfolio in capacitor technology.
Aluminum and Tantalum capacitors with conductive polymer cathodes were introduced in the mid 1990’s. Initial applications were in consumer electronics devices like notebook computers and other portable devices. Temperature ratings of 85°C or 105°C for 1000hr and moderate humidity resistance (60°C/90%RH) were sufficient for these applications.
As this technology matured, there was interest in using it in applications like automotive, data centers/telecom, and defense/aerospace. These applications have much more stringent requirements for reliability and lifetime under temperature, electric field, and humidity.
This talk will cover the mechanisms of Polymer capacitor degradation under these high stress conditions and the material science advances that resulted in new series being introduced that address these more demanding market segments and applications.
15:35 - 17:15 Session II. QUALITY & RELIABILITY
Chairman: TBC
2.1. Enhancing E-Textile Reliability: A Comparative Study of SMD-Ribbon Joints Protections Against Sweat
Speaker: Martin Hirman; University of West Bohemia, Pilsen, Czech Republic
In recent years, the field of e-textiles—textiles integrated with electronic components—has emerged as a significant and rapidly expanding market. These e-textiles find applications in various domains, including safety elements, healthcare products, and sports garments. Our research in this field has revealed critical insights into the behavior and durability of e-textile products and their components.
One of the key materials used in these textiles are electrically conductive ribbons, which are flexible and stretchable. Our previous experiments have demonstrated the feasibility of creating electrically conductive contacts between passive components and these ribbons through gluing or soldering techniques. However, a crucial question arises regarding the reliability of these connection methods in various operational environments.
Passive components, such as resistors, capacitors, and inductors, play a vital role in e-textile systems. These components do not require a power source to operate and are essential for controlling electrical current flow, storing energy, and filtering signals. In e-textiles, SMD versions of these passive components are preferred due to their compact size and suitability for flexible substrates. Our long-term observations indicate that e-textile products and electrical joints tend to exhibit degradation at a significantly accelerated rate compared to the SMD components themselves. This finding suggests that the interface between the textile substrate and the electronic components is a critical point of failure in e-textile systems.
E-textiles must withstand diverse conditions influenced by multiple factors. Sweat, for instance, can significantly affect smart textile sports or healthcare garments. To address this, we have investigated the reliability of joints between SMD chip resistors and textile ribbons during accelerated aging by synthetic sweat. By focusing on the behavior of passive components and their connections in challenging environments, we aim to improve the longevity and reliability of e-textile products.
This study investigates the reliability of connections between passive SMD components and conductive textile ribbons in smart textiles under accelerated aging conditions. Conductive ribbons with silver-coated copper microwires and two sample types were utilized: basic protection (encapsulation) and additional protection. For each type, ten SMD chip resistors (case size 1206) with theoretically 0 Ω resistance were attached to the ribbons using a special contacting technique. This method involved dispensing non-conductive UV-curable adhesive onto the ribbon, mounting the SMD components onto the conductive paths, applying defined pressure with a metal rod, and curing the adhesive with UV light under constant pressure.
The electrical connection is made by direct contact of pads and wires, mechanically fixed by the adhesive. Finally, the component is encapsulated with the same adhesive, creating basic protection. The additionally protected samples are prepared similarly but include protective seam-sealing textile adhesive tape for extra joint and conductive line protection.
The electrical resistance of the joints was measured using a four-point probe method with a Keithley DAQ6510 device. Samples underwent four accelerated aging cycles: immersion in acidic synthetic sweat (pH 4.4), followed by high-humidity aging (40°C, 93% RH for 164 hours), and drying (40°C, 40% RH for 2 hours). Electrical resistance was measured after each cycle.
Statistical analysis compared the two sample types, providing insights into the durability and reliability of these connections in harsh conditions. Results show that samples with additional protection better resist aging from acidic sweat. Although this protection reduces ribbon flexibility, it significantly enhances joint and ribbon durability. The comprehensive findings, including box chart results and protection details, will be presented in the full paper, contributing to the advancement of wearable smart textile technology.
2.2. New Generation of Metallized Film Capacitors Based on EPN for Solving Upcoming High Temperature and High Power Density Requirements
Speaker: Manuel Gómez; TDK Malaga, Spain
The power electronic development trend is currently driven by the development on power semiconductors, mainly due to the package improvements and the implementation of Wide-bandgap (WBG) semiconductors. As a consequence, power electronic applications are improving its efficiency and power density, upgrading the operation conditions that power electronic components have to achieve.
This paper focuses on solving the challenges from the film capacitor technology point of view related to higher operation temperature and higher power density requirements. A new high power metallized film capacitor has been developed, based on its state-of-the-art modular design series, where the conventional polypropylene polymer has been upgraded to the new material EPN (Ethylene-Propylene-Norbornene), increasing its rated operation temperature from +80ºC to +105ºC, and consequently its power density, maintaining reliability, lifetime, energy density and electromagnetic performance. Research is based on both empirical tests and electromagnetic and thermal simulations based on Finite Element Analysis.
The second part of the paper will focus on DC-Link application solutions, being compared to conventional polypropylene film capacitors, reducing its volume and analysing cost differences.
2.3. Protecting the Quality & Reliability of Passive (and Active) Components: the J-STD-075 PSL Classification & Labeling
Speaker: Arnaud Grivon; Thales Global Services, Meudon, France
While typically not the most expensive of a PCBA BoM (Bill of Materials), passive components are often the most numerous. Passive components also characterize by a wide variability in form factors and features.
In the early days of the RoHS directive implementation and transition to Pb-free soldering, it was shown that several passive component types could barely withstand higher Pb-free processing temperatures and could be damaged during the soldering stages.
This evolution evidenced temperature sensitivities of components such as aluminum, film and tantalum capacitors, inductors and transformers, fuses, crystals/oscillators, connectors…
About twenty years after the RoHS directive enforcement, progresses in materials and processes have been made to improve passive component resistance to Pb-free soldering temperatures but they still have processing limitations to a large extent.
In addition, contrarily to active components, lots of passive component types are not molded or resin encapsulated and turn out to be more exposed to PCBA cleaning compatibility issues.
These passive component sensitivities that induce PCBA processing limitations or adaptations are not new: they are captured since 2008 in the ECIA/IPC/JEDEC J-STD-075 joint international standard that defines a PSL (Process Sensitivity Level) classification and labeling system. More than fifteen years later, it must be admitted that the awareness regarding this standard remains very limited within passive component manufacturers with only few punctual examples of actual implementations and consideration. Despite all the quality and reliability issues this daily causes to high-end hardware electronics even when deploying extensive efforts upstream…
This paper will show the impacts PCBA processes can have on passive components and highlight the J-STD-075 standard requirements. Finally, the need to manage component sensitivities using J-STD-075 PSL classification will be underlined as a call to action for passive component manufacturers.
2.4. Lifetime Assessment for Capacitors in EPS Application
Speaker: Krzysztof Ptak; Nexteer Automotive, Poland
Usually the electrical engineer is obligated to prepare the lifetime calculation for capacitors and review them with automotive OEM. Some rules of using life equation especially for variable loads and temperature are not well popularized and equation itself ask for understanding.
Lifetime expectancy a historical note with discussion about lifetime equation and its roots of origin, 10 degree rule and connection with reaction speed. Open question to industry pointing out missing data and unstandardized specification.
The article will present search for lifetime equation background for use of aluminum capacitors in EPS (Electric Power Steering) application, showing different approaches and trying to simplify its understanding. Since some information are hard to judge without expertise knowledge, thus the open questions to industry will be addressed.
17:35 - 19:15 Session II. (cont.) QUALITY & RELIABILITY
Chairman: TBC
2.5. Development and Validation of the New IRCA S.p.A.’s Pure-Polyimide Flexible Heater for High-Reliability and High-Performance Markets
Speaker: Alessandra Marcer; IRCA s.p.a. Zoppas Industries; Italy
Standard FEP or Acrylic polyimide flexible heaters, which have a long history in IRCA S.p.A.’s portfolio for high performance applications such as medical, aeronautics, automotive and space flight, are limited in output power by the melting point of the materials used as an adhesive and insulator between the layers.
This paper presents the development (for the first time in Europe) and validation of the pure-polyimide heater (PPH) which eliminates all internal adhesive layers, allowing for higher maximum power density and operating temperatures up to 260°C. The PPH offers significant advantages such as very low thermal mass and thickness (minimum 50 microns overall), enhanced thermal transmission, and superior radiation resistance compared to traditional flexible heaters. Key benefits also include minimal outgassing and resistance to a wide range of chemicals. Furthermore, its construction is in line with incoming REACH regulations.
The paper also discusses the direct lamination process validated by IRCA to facilitate bonding of the heater on the heatsink, allowing operations at higher temperatures than common adhesives used for integrating flex heaters allow. Customers who require heaters already integrated with the heatsink now use this process.
2.6. Life Cycle Assessment of a Graphene-Based Supercapacitor: Environmental Hotspots and End-of-Life Strategies for Sustainable Energy Storage
Speaker: Gianmarco Gottardo; Politecnico di Milano, Italy
Global energy crises are increasingly driven by geopolitical tensions, depletion of non-renewable resources, and environmental degradation, placing significant strain on the energy supply chain. In response, there is growing momentum toward energy independence through sustainable alternatives, particularly renewable energy sources, which are essential for achieving net-zero carbon emissions and reducing reliance on fossil fuels. However, the integration of renewables into the energy mix necessitates advanced energy storage technologies to manage variability and ensure supply stability.
Supercapacitors (SCs) have emerged as a promising energy storage solution due to their high-power density and durability, with applications spanning electric vehicles, renewable integration, and low-power electronics. Despite their potential, the environmental impacts and end-of-life management of supercapacitors remain underexplored and unregulated. This study conducts a comprehensive Life Cycle Assessment (LCA) of a graphene-based cylindrical supercapacitor, evaluating its environmental footprint across manufacturing, distribution, use, and end-of-life stages.
The focus of the study was placed on the manufacturing and end-of-life phases. The analysis identifies graphene oxide production as the primary environmental hotspot during manufacturing. For end-of-life, recycling consistently offers greater environmental benefits compared to incineration, particularly through the recovery of aluminium, graphene oxide, and PTFE binder. Effective recycling processes, especially for active materials such as doped graphene, are critical to minimizing emissions and maximizing the environmental advantages of supercapacitor technology.
Overall, the findings underscore the importance of robust recycling strategies and targeted process improvements to enhance the sustainability of supercapacitors, supporting their role in the transition to a low-carbon energy system.
2.7. Capacitor Degradation and Failure Mechanisms: Exploring Different Causes Across Technologies
Speaker: Frank Puhane; Würth Elektronik eiSos GmbH & Co. KG; Germany
Capacitors are among the most failure-prone components in many electronic systems. In power supplies and other continuously operating power electronic equipment, capacitor failure is often the primary cause of system malfunction. Two distinct concepts are frequently referenced—sometimes interchangeably—in technical literature: capacitor degradation (or wear-out) and total failure.
Capacitor Degradation (Wear-Out) refers to the progressive deterioration of key characteristics, particularly capacitance and equivalent series resistance (ESR), which may be mission-critical. This process is often non-linear and tends to accelerate over time due to continued operation under worsening conditions.
Total Failure often represented through statistical models such as Failure in Time (FIT) rates and Mean Time Between Failures (MTBF), total failure may or may not result from prior degradation and/or operating conditions.
This paper summarizes the various causes of both degradation and total failure, analyzing why specific environmental factors impact certain capacitor types while leaving others largely unaffected.
2.8. Beyond 85/85: Towards Realistic Lifetime Estimation of Polypropylene Film Capacitors in Humid Environments
Speaker: Massimo Totaro; KEMET YAGEO Group; Italy
Polypropylene film capacitors (PPFCs) are crucial in electronic systems, requiring robust performance and reliable longevity. Traditional lifetime models often overlook humidity’s impact, leading to inaccurate predictions and unexpected failures. Customers may wrongly assume that higher-grade capacitors guarantee longer lifespans, ignoring the complex effects of temperature, humidity, and material properties.
Humidity significantly influences PPFC degradation. Moisture ingress, driven by vapor pressure gradients and material permeability, triggers failures, especially at high temperatures. Even at lower temperatures with high relative humidity (RH), condensation can create water films that accelerate corrosion.
Understanding failure mechanisms under humid conditions is vital. Partial discharges (PD) are particularly concerning, and advanced testing allows for detailed PD characterization under varying conditions. Analyzing PD patterns helps develop accurate degradation models and improves capacitor design.
A major challenge in creating humidity-dependent models is the lack of real-world environmental data. This scarcity leads to reliance on simplistic grade-based estimates, which are often inadequate. Traditional accelerated tests, like Temperature-Humidity-Bias (THB) at 85°C/85% RH, reveal material weaknesses but don’t reflect real-world conditions. While high endurance ratings from such tests seem impressive, they can mislead customers about actual performance.
Advancing capacitor reliability requires comprehensive testing beyond standard THB. Methods like endurance tests in varied environments, impedance spectroscopy, and advanced film characterization (SEM, ICP, XPS) provide deeper insights. In-situ monitoring of parameters like capacitance, dissipation factor, and leakage current further illuminates degradation progress.
KEMET YAGEO’s KEMET Lifetime Expectancy Model (K-LEM) aids in predicting the service life of metallized film capacitors in harsh conditions. Unique in considering ambient temperature, RH, applied voltage bias, and current harmonic load, K-LEM relies on extensive experimental data. It incorporates realistic conditions from applications like solar plants, domestic power supplies, and automotive chargers, focusing on environments with absolute humidity below 30 g/m³.
Unlike extreme THB tests with unrealistic conditions (e.g., 300 g/m³ at 85°C/85% RH), K-LEM emphasizes probable real-world scenarios, achieving up to 95% confidence in lifespan predictions. In conclusion, accurate PPFC lifetime estimation demands shifting from grade-based assumptions to models grounded in environmental realism, failure mechanism analysis, and advanced testing, enabling informed capacitor selection and long-term system reliability.
19:15 - 21:00 YAGEO Welcome Drink
9:00 - 10:30 Special Session: AI and Its Consequences
Chairman & Facilitator: Tomas Zednicek, EPCI
AI 1. Revolutionizing the Defect Detention during the Cross-Sectional analysis for Electronics with Computer Vision
Speaker: Mari Carmen López López; ALTER TECHNOLOGY, Spain
Cross-section analysis for electronics is used to reveal the structure and composition, layers, interfaces, cracks, voids, defects, etc. Cross-section analysis is useful for quality control (QC), failure analysis (FA), and research and development (R&D) of PCBs, PCBAs and other electronic components.
As electronics become increasingly complex and miniaturized, traditional manual inspection methods are increasingly labor-intensive and susceptible to human error. Over the past five years, deep learning techniques have significantly advanced the automation of defect detection, addressing challenges related to accuracy, efficiency, and adaptability in complex manufacturing environments.
This paper presents a computer vision system and the training to equip the tool with the necessary expertise to detect the main defect identified during the cross-section of electronics. This tool combines machine learning and Convolutional Neural Networks to teach computers to extract information from digital images and classify it. The objective of this study is to develop a tool to assist inspectors in analysing defects. The tool will harmonise the criteria used to evaluate anomalies and optimise the time dedicated to evaluating images.
Mari Carmen López López
ALTER Technology, Spain
AI 2. Passive Components in AI Systems
Speaker: Slavomír Pala; KYOCERA AVX, Lanskroun, Czech Republic
Passive components play a crucial role in AI systems. The exact passive component selected is a function of the AI system complexity and end application. Low level field deployed AI systems might rely upon consumer or possibly Auto Grade components. Enterprise and critical use systems might rely solely upon AECQ-200, COTS or MIL-PRF passives. Further, as AI evolves and matrixed machines providing back up processing – required levels of component reliability will change.
Regardless the use of passives can be lumped into 3 Areas:
1. Power delivery, power conversion and power distribution
2. Signal Integrity
3. Passive Glue – remaining component needs
A general overview of power delivery component potential follows.
Power delivery, power conversion and power distribution AI systems are based upon incredibly high-speed processing cores that can break up complex assignments into manageable sub tasks.
The semiconductors capable of processing assigned tasks have certain design characteristics that allow them to achieve maximum processing speeds. A common thread of those designs is very low operating voltages (for example 0.8 volts), incredibly high speed I/O ports, high temperature capability and a need for thermal control. Adequate use of MLCCs around high speed semiconductors optimizes signal integrity and allows the semiconductors to operate at the highest speeds available.
The following is a general cross section view of a High Speed semiconductor typical of AI applications. MLCCs play a huge role in each aspect of power delivery, power conversion and power distribution. An example of MLCC use close to the high speed AI computing core follows:
High capacitance MLCCs are used on the main board and underboard applications (See ilustration #1 & 2).
X5R Dielectric | KYOCERA AVX The massive power consumed by these complex ICs requires capacitors under the cavity of the IC and main board as well as land side capacitors under the processor package. Cavity capcitors (illustration #3, #5) are typically small case size capacitors that naturally have a small height associated with small case sizes. Land side capacitors (illustration #4) are typically ultra then devices with common thickness’s of 0.22mm, 0.15mm, 0.11mm and <0.1mm case size thin capacitors are typically selected package.
Larger value capacitors are needed for bulk capacitance to provide high amounts of charge to the high frequency capacitors and the high-speed semiconductors. Designers have their choice of multiple technology types ranging from high CV MLVs and Tantalum capacitors to Aluminum electrolytics and Polymer Tantalum devices. While MLCCs exhibit the lowest inductance, Tantalum and Tantalum Polymer technologies exhibit large capacitance values with low inductance. Thus, these devices are ideal for bulk applications. A general comparison of options are shown in comparison tables. The emergence of ultra low inductance bulk capacitors is presented on a high level.
Ron Demcko, KYOCERA AVX Components Corporation – Fountain Inn, SC, USA
Slavomír Pala, KYOCERA AVX, Lanskroun, Czech Republic
AI 3. AI Hardware Development and Its Consequences for Passive Electronic Components
Speaker: Tomas Zednicek; EPCI, European Passive Components Institute, Czech Republic
The rise of artificial intelligence (AI) has brought about a technological revolution, with its impact felt across various industries. However, this advancement comes with a significant energy cost, particularly within data centers that power AI operations.
A decade and a half ago, server CPUs and GPUs operated on a few hundred watts of power. Today, the Nvidia H100 GPU, used for training large language models, operates at a thermal design power (TDP) of 700W, and future processors are expected to exceed 1kW.
Power management is a critical concern in data centers that directly impacts thermal management and overall efficiency. One of the key advancements is the development of new power supply topologies. These innovative designs are crucial for enhancing power delivery and reducing waste. The transition from traditional 12V to 48V power distribution allows for a substantial reduction in power losses.
Passive components made a lot of progresses towards new technologies for processor coupling, 48V power system, increasing power rating characteristics. They must further adapt to architecture changes.
This paper discusses changes and challenges of AI systems and its consequences to selection of passive components. The progress will be demonstrated especially on example of fast development of MLCC ceramic capacitors to meet the fast-evolving requirements.
Tomas Zednicek Ph.D.; EPCI, European Passive Components Institute, Czech Republic
11:00 - 12:30 HOT Topic Panel Discussion
HOT PANEL DISCUSSION
Power Conversion Challenges and Consequences to Passive Components
Key Discussion Items
- AI in daily use of electronic manufacturers
- AI in use of passive electronic components manufacturers
- Consequence of AI fast development and architecture advancement to passive component requirements and its impact to selection guide.
AI users in passive manufacturing:
Alter Technology
Passive Components:
Philip Lessner; Philip Lessner Consulting
Academia:
University of Seville
Keynote IV. Space Evaluation Testing on SAW Filter Based on POI Technology
Speaker: Kaoutar Zeljami; ALTER TECHNOLOGY, Spain
During the past ten years, a significant number of innovations have been developed to enhance the capability of passive acoustic-electric devices to answer the imperative demands of filter characteristic improvement. Piezo-On-Insulator wafers have been developed to consider the use of such a device for satellite communications.
This work presents the results of the evaluation testing activities conducted by ALTER TECHNOLOGY on existing surface acoustic wave (SAW) filters, particularly L-band GPS filters, based on POI substrate developed by SOITEC Extensive testing was performed on L-band GPS SAW filters assembled in a 3.8SQ hermetic package within the framework of the HOMEMADE project. The primary objective of these tests was to assess the suitability of these filters for space applications and other markets with demanding environmental requirements, while simultaneously gathering critical data to support advanced filters development throughout the project.
The evaluation process included rigorous stress testing to determine the operational limits of temperature and power, as well as life testing, thermal cycling, and humidity assessments. Additionally, a comprehensive constructional analysis was carried out to gain detailed insights into the device’s structural integrity. The findings indicate that the device effectively meets the stringent requirements of harsh environments, with only minor manufacturing adjustments needed.
13:50 - 15:30 Session III. NEW DEVELOPMENT
Chairman: TBC
3.1. Textile-Based Antennas
Speaker: Tomas Blecha; University of West Bohemia, Pilsen, Czech Republic
Currently, there is a growing prevalence of electronic textiles (e-textiles). The aim of these e-textiles is to achieve a high level of integration of electronic components into the textile structure. The fundamental building block of e-textiles is conductive threads, which enable the realization of electrode systems, resistive heating elements, sensors, interconnect systems, and passive components, including planar textile antennas.
In recent years, textile antennas have garnered significant attention due to their lightweight, flexibility, and wearability, characteristics that make them ideal for various applications such as health monitoring, data transmission from sensors in Internet of Things (IoT) devices, and other communication systems. Planar textile antennas can be created using various techniques, including the embroidery or weaving of conductive patterns with the aid of conductive threads. These technologies facilitate the development of textile antennas for data transmission as well as antennas that can function as strain sensors.
For data transmission antennas, it is crucial to design and implement antennas with a defined resonant frequency that remains invariant under mechanical stress, while also considering the positioning on the human body and ensuring durability against standard textile maintenance. In contrast, textile antennas (resonant structures) utilized as strain sensors take advantage of the flexibility of textile materials; mechanical stress results in changes to the geometric dimensions, consequently altering the resonant frequency. These characteristics of textile antennas can be applied, for example, in monitoring limb swelling, assessing respiratory rates, and even in construction for monitoring structural displacements.
This article discusses the technological aspects of producing textile antennas to ensure the desired parameters are met, presents their electrical and mechanical properties, and explores potential applications for their use.
3.2. New Construction and Packaging Process for Highest Voltage Aluminium Polymer Electrolytic Capacitor
Speaker: Tim Kruse, PhD student; Syddansk Universitet Sønderborg; Denmark
Polymer Aluminium electrolytic capacitors exhibit high capacitance density while having lower series resistance and higher reliability than capacitors with a liquid electrolyte. Their biggest disadvantage are the voltage limitations, with commercial devices only going up to 100 V.
Increasing the voltage rating requires bigger can size, which is not possible due to difficult winding impregnation. In this work a process is shown to succesfully construct a high voltage polymer Aluminium electrolytic capacitor with a rated voltage of 750 V. For that, a high voltage anodization process was developed, enabling formation up to 1500 V.
Single Aluminium anode foils were anodized and stacked in parallel into a fan-like cathode structure with paper separators. The structure was then impregnated inside an Aluminium can and dried. The resulting capacitors showed high breakdown voltages of 835 V and a capacitance of 2 μF. The electrical performance was further demonstrated by leakage and ripple current measurements. In this study, flat Aluminium foils were utilized as the anode material, so any subsequent increase in surface area could significantly enhance capacitor performance and capacitance density. With an improved capacitance density, this technology could have great potential in DC link applications that require high voltage, high ripple currents, and high capacitance.
The drivetrain of an electric vehicle could be a potential application, where constant acceleration and recuperation lead to very high ripple currents.
3.3. A New Approach to the Design of High Precision Integrated Resistive Voltage Dividers
Speaker: Stephen Oxley; TT Electronics; UK
The simplest realisation of an integrated voltage divider is two resistor elements in series on a single substrate with a termination connecting to each of the three nodes. For high precision requirements metal foil or metal film technology offers intrinsically high precision properties, and for low voltage ratios the ratio tolerance can typically be down to 0.05% and tracking TCR to 2ppm/K. However, when a requirement for high voltage is added to the mix, this challenges the precision for two reasons. Firstly, it forces the adoption of thick film technology at least for the high voltage element, and this has poorer tolerance and TCR. And secondly, the ratio between resistor values is generally much greater, making matching of TCR and drift characteristics more difficult.
The methods currently used to mitigate these challenges to precision are generally focused on two areas. The first is to improve the absolute tolerance and TCR of thick film materials by material or process development. The second is to use component matching to yield higher precision and TCR tracking, either by switching to discrete matched parts, or by assembling an integrated component by attaching together two substrates.
This paper describes a third method of reconciling high voltage with high precision which is based on a re-design of the voltage divider at the schematic level. It shows how, by dispensing with the conventional two-element approach, an alternative design methodology promises to achieve high levels of precision with conventional thick film materials and processes and without the high cost of component matching.
3.4. Revolutionizing High Frequency Applications: 3-Terminal XG3 Eulex Gap Capacitor
Speaker: Colin McClennan; Quantic Eulex; USA
Decoupling capacitors play a vital role in high-frequency circuits and have various applications, including power supply bypassing, filtering, equalization, compensation, and noise suppression. In these high-frequency scenarios, the impedance of the capacitors is crucial, as the equivalent series inductance (ESL) can limit their effectiveness. Multi-layer ceramic capacitors (MLCCs) are the industry standard because of their high capacitance, compact size, and ease of use. However, the physical construction of MLCCs introduces ESL, which can reduce their effectiveness at high frequencies.
Over the years, there have been many improvements to multilayer ceramic capacitors (MLCCs) aimed at reducing equivalent series inductance (ESL). These improvements include various package sizes, electrode designs, and chip arrays. One of the most significant advancements is the development of the 3-terminal capacitor, also known as the X2Y capacitor, which effectively lowers ESL by minimizing “mounting inductance.” Mounting inductance refers to the inductance that arises from the interaction between the capacitor and the printed circuit board (PCB) to which it is connected. This factor is one of the key differences between 2-terminal and 3-terminal capacitors.
Another class of capacitors that have extremely low ESL are single-layer capacitors (SLC). SLCs have excellent performance at very high frequencies because the inductance associated with the device electrodes (or leads) can be reduced to near zero. However, at least two challenges arise with the use of SLCs. The first is that high capacitance is difficult to achieve with only one capacitive layer, with capacitance being limited by how thin this layer can be made. The second is that SLCs require wire bonding in order to be used in typical printed circuit board designs.
New advancements in capacitor designs, including the gap capacitor by Quantic Eulex, have begun to address these limitations. The gap capacitor achieves similar performance to the SLC, due to its ultra-thin, single capacitive layer, but eliminates the need for wire bonding, due to its surface mount design. Despite the excellent ESL of the 2-terminal gap capacitor, it is still limited by mounting inductance. The industry’s first 3-terminal gap capacitor by Quantic Eulex achieves the best of both worlds, leveraging the high-frequency performance of the SLC, while achieving the extremely low mounting inductance of the 3-terminal capacitor, all within a surface-mountable package.
16:00 - 17:40 Session IV. MATERIALS & PROCESSES
Chairman: TBC
4.1. Flaked Tantalum Powders: High Capacitance Powders for High Reliable Tantalum Capacitors
Speaker: Gordon Smith; Global Advanced Metals; USA
Tantalum based capacitors are a critical component when electronic devices require reliable performance across a wide variety of environmental conditions. The tantalum capacitor offers stable capacitance over a range of temperatures and voltages, long life with no piezoelectric effect, high reliability, and high volumetric efficiency. These features are particularly attractive for growing applications including servers, space, and autos that are demanding even greater operating voltages.
To achieve the higher performance, it is important to choose the proper tantalum powder to produce the capacitor anode. Typical tantalum powders are comprised of spheroidal (nodular) tantalum particles with defined, reproducible particle size distributions. As the operating voltages of devices increase, the size of the tantalum particles increase to enable thicker dielectrics to hold the higher voltages; however, achieving the performance improvement is to the detriment of the overall volumetric efficiency of the device. Altering the particle shape from nodular to a higher aspect ratio plate-like geometry will exhibit characteristics of higher capacitance at a comparable operating voltage.
These high aspect ratio particles found in flaked tantalum powders have historically exhibited attractive performance including high capacitance at high voltage, high breakdown voltage, low DC leakage, and improved ESR, leading to their use in many commercial applications today. The characteristics of these unique tantalum powders are very important to consider when designing capacitors operating at higher voltages or in high reliability applications.
We will review the key aspects of commercial flaked tantalum powders, the manufacturing methods to produce the powders, how the flake powders perform against traditional nodular powders, and touch on theoretical explanations for the performance improvements.
4.2. Reliability of E-Textile Conductive Paths and Passive Component Interfaces
Speaker: Julie Hladikova; University of West Bohemia, Pilsen, Czech Republic
E-textiles combine traditional electronic components with textiles like conductive threads and ribbons. These can be uninsulated or insulated with a protective layer. The samples use conductive hybrid threads made of polyester monofilament fibres and silver-coated copper microwires. In insulated versions, microwires are coated with polyurethane.
E-textiles are used in healthcare, telemedicine, protective clothing, and sportswear. This study focuses on evaluating their durability through wash cycles, which involve mechanical, chemical, and thermal stress.
SMD resistors were attached to conductive ribbons using UV-curable non-conductive adhesive. Four protective methods were tested:
- No protection: components secured with adhesive on uninsulated ribbon.
- Basic protection: components encapsulated with UV-curable adhesive.
- Additional protection: using iron-on tape to safeguard uninsulated paths.
- Basic protection on ribbons with insulated hybrid-conductive threads.
The study also assessed the resistance of conductive paths within ribbons using three protection methods:
Basic ribbon with silver-coated copper microwires, no protection.
Same ribbon with iron-on tape protection.
Ribbon with insulated hybrid conductive threads.
Samples underwent 30 wash cycles at 40°C. After every fifth wash, they dried at 40°C and 20% humidity for 48 hours before resistance measurement.
The results compare the reliability of different protective methods for conductive wires and connections. Full data and conclusions are in the complete paper.
4.3. Layer-by-Layer Fabrication of Thin Polypropylene-based Dielectrics
Speaker: Bartosz Gackowski; Centre for Industrial Electronics, University of Southern Denmark
Polymer film capacitors are widely used in electronics for filtering and smoothing in power supply circuits, for example in automotive or renewable energy systems. They are built from two electrodes separated by an insulating dielectric material, and polypropylene (PP) is currently dominating the dielectric film market due to its high dielectric strength, low dielectric loss and well-established large-scale production.
However, the dielectric constant of PP is just 2.2, which leads to energy density within 1-4 J/cm3. In contrast, the energy density of aluminum electrolytic capacitors is around 5 J/cm3. Consequently, any application requiring high capacitance values will lead to an increase in volume and weight of the capacitors, effectively decreasing the weight efficiency and increasing volume of power electronic systems. A common approach toward increasing the dielectric constant is doping the dielectric with nanoparticles, but they must be well dispersed to observe an improvement in dielectric properties.
On the other hand, the layer-by-layer (LbL) fabrication technique has emerged as a promising method for creating thin polypropylene-based dielectrics, offering precise control over dielectric properties and enabling the development of advanced capacitors. This method involves the successive deposition of ultra-thin layers of polypropylene or other polymers, allowing for the fine-tuning of dielectric thickness and morphology, which is crucial for optimizing the performance of film capacitors.
This work shows how LbL can be utilized to increase the energy density of PP through doping it with nanoparticles, such as barium titanate and silicone dioxide. It was observed that chemical functionalization of nanoparticles was crucial to increasing the dielectric constants and breakdown strengths, and effectively the energy density. The method also allows to create complex dielectric layer arrangements, such as alternating layers of PP and nanoparticle-filled composite layers or stacking layers with different types of nanoparticles. Therefore, this method provides a versatile and scalable approach to producing high-performance dielectrics with tailored properties, paving the way for the development of next-generation film capacitors.
4.4. Development and Prototyping of Nitrogen-Doped Graphene Supercapacitors
Speaker: Veronika Šedajová; Palacký University Olomouc, Czech Republic
The rapid growth of electromobility, mobile technology, and the Internet of Things is driving unprecedented demand for efficient and scalable energy storage solutions. While lithium-ion batteries remain dominant, carbon-based supercapacitors are emerging as a safer, longer-lasting, and faster-charging alternative. To overcome the key limitation of low energy density in supercapacitors, we present a novel graphene material derived from fluorographene. This scalable, chemically versatile approach enables the synthesis of high-performance electrode materials such as nitrogen doped graphene with exceptional structure and electrochemical performance.
Our material breakthrough is coupled with an industrially oriented strategy to validate a deposition technique for electrode fabrication and initial prototype testing using an industry validated procedure. Optimization of electrode thickness, electrolyte selection the design of layered and cylindrical supercapacitor pouch cells was pursued to demonstrate viability at the pilot level. The feedback loop between laboratory-scale research and pilot-scale production ensures robust scalability. This comprehensive approach bridges fundamental material innovation with practical implementation, establishing a pathway toward advanced, high-energy-density supercapacitors tailored for real-world applications.
18:00 - 19:30 ALTER TECHNOLOGY TEST FACILITY TOUR
20:00 - 23:00 Murata Gala Dinner
9:00 - 10:40 Session V. APPLICATIONS
Chairman: TBC
5.1. High-Performance Component Strategies to Address Thermal and Frequency Challenges in Base Stations
Speaker: Che Wei Hsu; Murata Europe; Netherlands
Modern telecommunications infrastructure heavily relies on base station power amplifiers (PAs) to amplify signals at 5G and 6G frequency bands to ensure uninterrupted communication.
Nevertheless, this PAs work under severe environmental conditions such as elevated temperature, humidity, and mechanical stress. Resulting from this is circuit design tradeoffs such as thermal issues, signal degradation, and limited space for components.
This paper discusses PA design challenges and provides solutions through optimal capacitor selection, highlighting how high-Q capacitors with thermal resilience, low ESR/ESL, and compact design overcome performance limitations in demanding environments.
5.2. Automotive Polymer Tantalum Capacitors with capabilities beyond AEC-Q200 – Guidelines for usage on LEO Satellite Industry
Speaker: Cristina Caetano; KEMET, a YAGEO Company, Portugal
From ground stations to satellite payloads, every segment of the Low Earth Orbit (LEO) satellite industry seeks reliable component technologies combined with mature manufacturing processes and controlled costs.
These satellite constellations will expand with thousands of new and enhanced small satellites to deliver next-generation global broadband coverage, offering improved data transfer, and faster, more reliable satellite communication services.
These applications have challenged the capacitor industry during the last few years.
New materials and manufacturing processes have enabled polymer tantalum capacitors to fulfill capabilities beyond AEC-Q200 stress test requirements demonstrating higher performance levels during screening and LAT testing protocols.
On this presentation we focus on guidelines for usage on the LEO satellite industry.
5.3. Improving Switched-Mode Power Supplies Performance with Modified Thermal Interface Material
Speaker: Victor Solera; University of Valencia; Spain
The trend that electronics is following is the use of switched-mode power supplies (SMPS) in more devices. This is due to an issue with energy efficiency. SMPS is closely related to the concept of power density. Power density is defined as the equipment’s power output per unit volume. Therefore, SMPS are required to take up a small space, high power density. This requirement or trend of SMPS can be achieved by using high switching speeds, high dv/dt.
The high switching speeds enable the SMPS’ components, primarily the inductor, to have lower inductance and, therefore, be smaller. Thus, by requiring less space, the power density is higher.
Voltage converters use a switching element, in most cases this component is the mosfet. The mosfet can reach high temperatures during operation. Therefore, heatsinks are added to reduce the temperature. Additionally, a thermal interface material (TIM) foil is used in conjunction with the heatsink. This foil is placed between the mosfet’s thermal pad and the heatsink to prevent electrical conductivity for safety reasons.
However, the use of high frequencies improves the power density but worsens the electromagnetic compatibility (EMC) aspect of the circuit. This is because fast switch speed is a source of electromagnetic interference (EMI). The effect of fast switch speeds is more significant when heatsinks with a TIM foil are used to reduce the mosfet temperature. This is due to a parasitic capacitance that is formed, whose current increases with high dv/dt. Thus, generating high levels of common-mode (CM) current.
Most EMI solutions typically compromise the device’s thermal performance, and vice versa. Therefore, an attempt is made to reach a trade-off between the two topics. In this paper, a hybrid solution is proposed to achieve a favorable trade-off between thermal and EMI aspects. This solution consists of a copper foil between two TIM foils. Allowing, firstly, to maintain the electrical isolation between the mosfet and the heatsink. And, finally, to reduce conducted CM interferences while the thermal aspect is not significantly deteriorated.
The tested and modelled passive component for thermal management and common-mode current filtering is capacitor.
5.4. Resonant Capacitors in High-Power Resonant Circuits
Speaker: Moaz ElGhazali; Murata Europe; Germany
This article reviews the market trends and technological advancements in power supply systems for high-power applications, focusing on resonant circuits in devices such as automotive on-board chargers (OBCs), server power supplies, and wireless power transfer (WPT) systems.
The adoption of LLC resonant circuits has risen significantly, exceeding 90% in high-efficiency power supplies of 100W or more. As demand grows for resonant capacitors with stable capacitance values over 10nF and low-loss performance, multilayer ceramic capacitors are emerging as the preferred choice due to their advantages over traditional film capacitors. This paper discusses key requirements for resonant capacitors, including considerations for high voltage and frequency applications in harsh environments, highlighting the characteristics that make multilayer ceramic capacitors suitable for these roles.
Additionally, it introduces a range of medium- to high-voltage multilayer ceramic capacitors designed to meet the needs of modern high-power applications while addressing limitations related to self-heating and voltage derating. To facilitate effective selection processes, we present Murata’s “Simsurfing” tool that aids engineers in choosing appropriate resonant capacitors based on operational parameters. This comprehensive overview underscores the importance of understanding capacitor characteristics in advancing technologies within the rapidly evolving landscape of high-power electronics.
11:10 - 12:50 Session VI. DESIGN & CONSTRUCTION
Chairman: TBC
6.1. Qualification of Commercial Off-The-Shelf Supercapacitors
Speaker: David Latif; EGGO Space, Lanskroun; Czech Republic
This paper delves into comparative test results conducted by EGGO Space on large-size supercapacitors. The challenge faced by supercapacitor manufacturers lies in the varying electrical parameter measurement techniques employed, making direct comparison of datasheets difficult.
To ensure high-quality results, the test results presented in this paper adhere to the IEC 62391 standard methods. A total of 10 units of each product were tested.
In an example, Supplier 1’s COTS supercapacitors demonstrated exceptional power performance due to significantly lower ESR compared to their competitors. The ESR was three times lower than that of their rivals.
The test results will be contextualized by highlighting the impact of ESR on round-trip efficiency, capacitor temperature performance, and the corresponding effect on the supercapacitor’s lifetime.
6.2. Experimental Evaluation of Wear Failures in SMD Inductors
Speaker: Masaaki Tsujii; Murata Manufacturing Co., Ltd.; Japan
In recent years, the advancement of electronic devices in mobility has made ensuring signal integrity and addressing EMI increasingly important. Our inductors are being adopted more frequently by Tier 1 suppliers. During the component certification process, we receive requirements equivalent to lifespan evaluations known as Mission Profile assessments.
To conduct a Mission Profile assessment, it is necessary to evaluate the worst-case risk failure mode and its activation energies. We have been conducting research on wear failure modes in SMD inductors, and we will present our findings on this topic.
6.3. How to Manage Leakage Current and Self Discharge of EDLC Capacitors
Speaker: Gerald Tatschl; Vishay; Austria
Electric double-layer capacitors (EDLCs) combine the exceptionally large surface area of activated carbon, a liquid, highly conductive electrolyte, and the physical phenomenon of double layers to achieve extremely high capacitance. Due to its high capacitance value in combination with high discharge current, this technology is increasingly taking on an important role between traditional aluminum electrolytic capacitors and rechargeable batteries.
In some applications, a bridging time of hours, days, or even months is required after the power supply has been switched off. In these cases, it is very important to understand and account for the inevitable self-discharge due to leakage currents and their inherent temperature dependence. Typical characteristics and design considerations are discussed in this paper.
6.4. Advancements in Flexible End Terminations for High-Reliability Passive Components in Electrified Vehicles
Speaker: Dean Buzby; Heraeus Electronics; USA
The automotive industry is undergoing continued transformation towards electrification, significantly impacting the demand for robust thick film products in both Internal Combustion Engine (ICE) and Electric Vehicles (xEVs). This paper presents the development of a novel flexible end termination solution for multilayer chip capacitors (MLCCs), aimed at enhancing performance in high-reliability applications essential for modern vehicles.
The shift towards EVs has shown a doubling of the number of units from 2022 to 2026 and will double again by 2031, leading to an increased requirement for electronic components. ICE vehicles typically incorporate between 2,000 and 3,000 capacitors, while EVs may require between 15,000 and 20,000. The growing complexity of systems including radar, heads-up displays, telematics, connectivity, infotainment, propulsion, battery management, and high-voltage inverter circuits necessitates components that can meet higher performance and reliability standards to satisfy stringent warranty and liability requirements.
However, the increased use of electronic components presents significant challenges. The primary failure mode for surface mount device (SMD) passive components is cracking caused by board flexure, which can lead to shifts in capacitance, resistance, or inductance, as well as current leakage and circuit failures. It is imperative to enhance component reliability to mitigate these risks effectively.
Our innovative flexible end terminations provide a critical solution to these challenges. Traditional post terminations are based on thermoset epoxy chemistry which complicates paste logistics, including shipment, storage, and preparation, as well as generate scrap after processing valuable silver paste. Our new formulation exhibits room temperature stability and a lengthy pot life, facilitating seamless production without extended preparation times. This flexible termination utilizes high-temperature thermoplastics that enhance material durability. Testing demonstrates a capability for bending up to 10mm, surpassing the previous industry standard of 3 or 5mm.
In addition to performance enhancements, the implementation of flexible terminations yields significant cost benefits. Eliminating the need for expensive shipping methods and refrigeration reduces logistical expenses and storage costs, while also decreasing waste associated with high silver (Ag) content materials.
In conclusion, as the automotive landscape continues to evolve towards greater electrification, the demand for reliable and efficient passive components is paramount. Our flexible end termination solution is positioned as a transformative advancement that addresses both operational challenges and heightened reliability requirements, ultimately contributing to the safety and performance of electrified vehicles.
12:50 - 13:00 PCNS Best Paper Award & Closing
5th PCNS AWARDS
PCNS BEST and OUTSTANDING PAPER AWARDS
PCNS Award Process and Rules
These awards aim to recognize the efforts of companies and individuals in conducting high-quality research and innovation in the field of passive electronic components. All conference papers submitted are eligible for these awards.
The ceremony announcing the nomination of the best paper and the outstanding papers will be held during the PCNS closing session to present special awards.
The evaluation process is conducted by the TPC committee in a transparent three-step manner:
Step 1: Abstract Evaluation – Submitted abstracts are evaluated by the TPC in five points each for novelty, content quality, and suitability. Low-quality and unsuitable papers are rejected. The mean sum value of all papers is calculated, and the five best papers are nominated for the award.
Step 2: Full Paper Evaluation – The TPC committee evaluates the five nominated full papers (again, each for novelty, content quality, and suitability). The paper with the highest mean values receives five points, while the least performing paper receives one point.
Step 3: Presentation Evaluation – TPC committee members at live PCNS event listen to the presentations of the five nominated papers and evaluate the best speech with five points, while the least performing speech receives one point.
ONE Best and TWO Outstanding Papers are selected based on the sum of points from Step 2 and Step 3. In case of an equal score, the live speech receives more weight. If the decision remains undecided, the TPC president(s) has the authority to make the final decision.
Notes:
- The evaluation and nomination process remain confidential until the closing ceremony.
- If there is a conflict of interests among the TPC members (co-authoring a paper), they are not permitted to evaluate and score such papers.
- The TPC committee members has the right to nominate one additional paper for the full paper evaluation as a “wild card.”
5th PCNS COMMITTEES
Organizing Committee
Presidents:
- Francisco Rogelio Palomo Pinto; University of Seville, Spain
- Tomas Zednicek, Ph.D.; EPCI, Czech Republic
Members:
- Gonzalo Fernández Romero; ALTER TECHNOLOGY, Spain
Fernando Muñoz Chavero; University of Seville, Spain
Technical Programme Committee
Presidents:
- Manuel Sánchez; ALTER TECHNOLOGY Seville, Spain
- Tomas Zednicek, Ph.D.; EPCI, Czech Republic
Manufacturer Representatives
- Christian Merkel, Murata Electronics Europe, Germany
- Ron Demcko, KYOCERA AVX Corporation; USA
- Frank Puhane, Würth Elektronik eiSos; Germany
Universities
- Francisco Rogelio Palomo Pinto; University of Seville, Spain
- Tomas Blecha; University of West Bohemia, Pilsen; Czech Republic
Agencies
- Joaquín Jiménez, ESA ESTEC; The Netherlands
- Alexander Teverovsky Ph.D., ASRC / NASA; USA
Dimas Morilla, ALTER TECHNOLOGY, Spain