PCNS 2025 Seville, spain
5th PCNS September 9-12th 2025
The 5th edition of the PCNS Passive Components Networking Days Symposium is hosted by Escuela Técnica Superior de Ingeniería de Sevilla of Universidad de Sevilla, Spain in partnership with Alter Technology as a live event.
Conference Theme
Passive Components in Harsh Environment
PROGRAM
Tuesday 9th September – Workshop & CNA Tour
- 13:00–14:00 – Workshop I: Passive Components Technologies Update; Design Review of EMI Filter for Power ElectronicsSpeaker: Frank Puhane, Würth Elektronik eiSos GmbH & Co. KG
- 14:30–15:50 – Workshop II: Selection, Procurement, and Testing of Passive EEE Components for Harsh EnvironmentsSpeaker: Manuel Sánchez, ALTER TECHNOLOGY
- 16:10–17:30 – Centro Nacional de Aceleradores Tour
Wednesday 10th September – Conference & Networking
- 09:00–09:30 – Welcome by University of Seville, ALTER TECHNOLOGY, and EPCI
- 09:30–09:55 – Keynote I: European Passive Components Market – Speaker: Luca Primavesi, Itelcond president and EPCIA member
- 09:55–10:00 – EPCIA Student Awards Ceremony
- 10:00–10:30 – Speakers Introduction
- 11:00–12:00 – TPI Flash Presentations (5 min each)
- 12:00–12:30 – Keynote II: Quality Challenges and Risk Mitigation for Passive Components in Harsh Environments Speaker: Antonio Rodriguez Arenas, ALTER TECHNOLOGY
- 13:20–14:35 – Session I: Harsh Applications – Chair: Frank Puhane
- Thermoset Polymer Dielectric Capacitors – Angelo Yializis, Polycharge Inc.
- Tantalum Capacitor Technology Advantages for Harsh Environment– Michel Bouvier, Vishay
- Silicon Capacitors Reliable Performance in Harsh Conditions – Enzo Darcy, Murata Europe
- 15:05–15:35 – Keynote III: Environmental Performance of Polymer Capacitors Speaker: Philip Lessner, USA
- 15:35–17:15 – Session II: Quality & Reliability – Chair: Manuel Sánchez
- E-Textile SMD-Ribbon Joints Protections Against Sweat – Martin Hirman, University of West Bohemia
- New Generation of EPN Metallized Film Capacitors for Solving High Temperature and High Power Density Requirements – Manuel Gómez, TDK Malaga
- Protecting the Quality & Reliability of Passive (and Active) Components: the J-STD-075 PSL Classification & Labeling – Arnaud Grivon, Thales Global Services
- Lifetime Assessment for Capacitors in EPS Application – Krzysztof Ptak, Nexteer Automotive
- 17:35–19:15 – Session II (cont.)
- Validation of the New IRCA Pure-Polyimide Flexible Heater for High-Reliability and High-Performance Markets – Alessandra Marcer, IRCA S.p.A.
- Life Cycle Assessment of a Graphene Supercapacitor: Environmental Hotspots and End-of-Life Strategies – Gianmarco Gottardo, Politecnico di Milano
- OUTSTANDING PAPER AWARD: Capacitor Degradation and Failure Mechanisms: Exploring Different Causes Across Technologies – Frank Puhane, Würth Elektronik
- Beyond 85/85: Towards Realistic Lifetime Estimation of Polypropylene Film Capacitors in Humid Environments – Massimo Totaro, KEMET YAGEO
- 19:15–21:00 – YAGEO Welcome Drink
Thursday 11th September – Panel Discussion & Sessions
- 09:00–10:30 – Special Session: AI and its Consequences – Chair: Tomas Zednicek
- Defect Detention during the Cross-Sectional analysis for Electronics with Computer Vision – Mari Carmen López López (presented by Fernando Romero Madera & Carmen Galán Cebrero). ALTER Technology, Spain
- Passive Components in AI Systems – Slavomír Pala, KYOCERA AVX
- AI Hardware Development and Its Consequences for Passive Electronic Components – Tomas Zednicek, EPCI, Czechia
- 11:00–12:30 – Panel Discussion: AI and Passive Components
- 13:20–13:50 – Keynote IV: Space Evaluation Testing on SAW Filter Based on POI Technology – Kaoutar Zeljami, ALTER Technology, Spain
- 13:50–15:30 – Session III: New Development – Chair: Frank Puhane
- Textile-Based Antennas – Tomas Blecha
- BEST PAPER AWARD: New Construction and Packaging Process for Highest Voltage Aluminium Polymer Electrolytic Capacitor – Tim Kruse, SDU Denmark
- A New Approach to the Design of High Precision Integrated Resistive Voltage Dividers – Stephen Oxley, TT Electronics, UK
- OUTSTANDING PAPER AWARD: Revolutionizing High Frequency Applications: 3-Terminal XG3 Eulex Gap Capacitor – Mark Simpson, Quantic Eulex, USA
- 16:00–17:40 – Session IV: Materials & Processes – Chair: Tomas Blecha
- Flaked Tantalum Powders: High Capacitance Powders for High Reliable Tantalum Capacitors – Gordon Smith, GAM, USA
- Reliability of E-Textile Conductive Paths and Passive Component Interfaces – Julie Hladikova, University of West Bohemia
- Layer-by-Layer Fabrication of Thin Polypropylene-based Dielectrics – Bartosz Gackowski, SDU, Denmark
- Development and Prototyping of Nitrogen-Doped Graphene Supercapacitors – Veronika Šedajová, Palacký University Olomouc, Czechia
- 18:00–19:30 – ALTER TECHNOLOGY Test Facility Tour
- 20:00–23:00 – Murata Gala Dinner
Friday 12th September – Sessions & Closing
- 09:00–10:40 – Session V: Applications – Chair: Francisco Rogelio Palomo Pinto
- High-Performance Component Strategies to Address Thermal and Frequency Challenges in Base Stations – Che Wei Hsu, Murata Europe
- Automotive Polymer Tantalum Capacitors beyond AEC-Q200 – LEO Satellite – Cristina Caetano, KEMET YAGEO, Portugal
- Improving Switched-Mode Power Supplies Performance with Modified Thermal Interface Material – Victor Solera, University of Valencia; Spain
- Resonant Capacitors in High-Power Resonant Circuits – Moaz ElGhazali, Murata Europe
- 11:10–12:50 – Session V: Design & Construction – Chair: Tomas Zednicek
- Qualification of Commercial Off-The-Shelf Supercapacitors – David Latif, EGGO Space, Czechia
- Experimental Evaluation of Wear Failures in SMD Inductors – Masaaki Tsujii, Murata, Japan
- How to Manage Leakage Current and Self Discharge of EDLC Capacitors – Gerald Tatschl, Vishay Austria
- Advancements in Flexible End Terminations for High-Reliability Passive Components in Electrified Vehicles – Dean Buzby, Heraeus, USA
- 12:50–13:00 – Best Paper Awards & Closing Ceremony
- 13:00 – Lunch