the PCNS conference was supported by the Fabrikant Mads Clausen (FMC) Foundation
first 15 students fee waived by PCNS thanks to FMC support !
organized by:
in co-operation with:
Danfoss Drive
PEDC Magazine by Elsevier
4th PCNS
The 4th edition of the PCNS Passive Components Networking Days Symposium was hosted by SDU University of Southern Denmark, Sønderborg 11-14th September, 2023
4th PCNS SYMPOSIUM THEME
THEME
New Passive Components Technologies for Efficient Power Conversion
Sponsors
Partners
Danfoss Drive
About Danfoss Drive
Danfoss Drives is a global leader in AC/DC and DC/DC power conversion, as well as variable speed control for electric motors. With the world’s largest portfolio of power converters, VLT® drives, and VACON® drives at your fingertips – and backing from a partner whose legacy has been built on decades of passion and experience – your journey to a better future is only just beginning.
FINAL PROGRAM
Workshop & SDU Tour Day 1 11th September 2023
- 13:00–14:00 Workshop Part I. Passive Components Technologies for Efficient Power Conversion; SDU & Danfoss Drive (registration required, no fee for conference attendees)
- 14:30–15:50 Workshop Part II. Passive Components Technologies for Efficient Power Conversion Case Study: 25kW SiC Power Supply; OnSemi and WE; (registration required, no fee for conference attendees)
- 16:00–18:00 SDU University Tour; Tour through SDU University facility and laboratories (registration required, no fee)
Conference & Networking Day 2 12th September 2023
- 9:00–9:30 Welcome prof. Thomas Ebel; SDU Sønderborg and Tomas Zednicek Ph.D.; EPCI
- 9:30–9:55 Keynote I. European Passive Components Market; EPCIA European Passive Components Industry Association
Thomas Ebel; EPCIA board member - 9:55–10:00 EPCIA Student Awards Ceremony; Thomas Ebel; EPCIA
- 10:00–10:40 Speakers Introduction
- 11:00–11:50 TPI Technical Product Introduction Flash Presentations – 5min short commercial presentations from manufacturers to introduce its hot product / news or invitations to exhibition booth
Session I. TECHNOLOGY & ROADMAPS
12:40–14:40
- Improving High Voltage Power Modules with new Silicon Snubber Capacitor technology; Tom Choicy; MURATA, Germany
- Main failure modes on connectors – Feedback from Failure Analyses on connectors – all electronic sectors; Eric Zaia; SERMA TECHNOLOGIES, France
- 3V EDLC products for a longer useful life; Gerald Tatschl; Vishay BCcomponents, Austria
- Quality Assessment and Lifetime Prediction of Base Metal Electrode Multilayer Ceramic Capacitors: Challenges and Opportunities; Pedram Yousefian, Center for Dielectrics and Piezoelectrics, PennState University, USA
Session II. MATERIALS & PROCESSES
15:00–17:00
- Responsible and Stable Tantalum Supply; Kurt Habecker; GAM Global Advanced Metals; USA
- Extending the capacity and high voltage performance of Ta-capacitors; Melanie Stenzel; TANIOBIS GmbH; Germany
- Voltage Dependence of Ferroelectric Class 2 Multilayer Ceramic Capacitors; Frank Puhane; Würth Elektronik eiSos GmbH; Germany
- Thick Film on Steel Resistor Technology – Increasingly Power Dense & Demanding Applications; Chris Muter; TT Electronics; UK
- Assembly technology of electronic components for e-textiles; Tomas Blecha; University of West Bohemia; CR
- Graphene derivatives for energy storage applications; Michal Otyepka; CATRIN, Olomouc; Czech Republic
- Evaluation of key parameters for supercapacitors based on activated carbons derived from the plastic waste; Vojtěch Kupka; CATRIN, UPOL University, Czech Republic
- Smart textile speaker; Julie Hladikova; University of West Bohemia, Pilsen, Czech Republic
Panel Discussion & Sessions Day 3 13th September 2023
- 9:00–9:30 Keynote II. Advanced SiC Power Modules and Stacks for E-Mobility; Fabio Carastro Semikron Danfoss; Denmark
- 9:30–10:30 Hot Topic Panel Discussion Power Conversion Challenges and Consequences to Passive Components
Panelists: semiconductor, passive component manufacturers & end users experts
Session III. QUALITY & RELIABILITY
10:50–11:50
- Climatic reliability of electronic parts – solution of the challenge; Vladimir Sítko; PBT Works, Roznov p.Radhostem, Czech Republic
- Selecting MLCC’s That Meet High Reliability Requirements of Medical Implantable Devices; Victor Lu; Knowles Precision Devices
- De-risking plan at Cryogenic Temperatures for PETERCEM microswitch; Manuel Sánchez; Alter Technology; Spain
- Ceramic capacitors: recent in-orbit failure and proposed way forward; Adrià Escoda; Joaquín Jiménez; ESA ESTEC; The Netherlands
- Derating and Technology in Solid Electrolytic and Polymer Tantalum Capacitors; Y.Freeman; KEMET YAGEO; USA
- Degradation of Aluminum and Tantalum Wet Electrolytic Capacitors during High Temperature Storage; Alexander Teverovsky; Jacobs/NASA- GSFC; USA
Sessions & Closing Day 4 14th September 2023
Session IV. NEW DEVELOPMENT
9:00–11:00
- High Energy Density NanoLamTM Capacitors for Use in Spacecraft Power Processing Units; Angelo Yializis Ph.D; Polycharge America Inc; USA
- Shielding metal effect on polypropylene thin-film during focused helium-ion beam irradiation; Shova Neupane; SDU University of Southern Denmark; Denmark
- Layer-by-layer printing: how we fabricate the next generation of nanocomposite capacitors for more efficient power electronics; William Greenbank; SDU University of Southern Denmark; Denmark
- Development of a New High-performance Polymer Aluminium Electrolytic Capacitor; Shova Neupane; SDU University of Southern Denmark; Denmark
Session V. APPLICATIONS
11:20–13:50
- How to select gate resistor – from discrete to back-contact-bondable resistors; Ove Hach; Vishay BCcomponents Beyschlag GmbH; Germany
- A look at Modern Capacitors used in power conversion; Ron Demcko; KYOCERA AVX Corporation; USA
- Understanding the influence of ESR and Ripple Current for the capacitor selection; Alexander Nebel; YAGEO; Germany
- Latest Generation of EMI Suppression (Film) Capacitors for xEV Systems; David Olalla; TDK; Germany
- Advancement of power electronics through Ceramic Y-Capacitor Technology; Moaz El Ghazali; Murata; Germany